From the 90’s, the evolution of semiconductors has increased rapidly and the integration of millions of transistors in the chip increasing the performance, longevity and reliability of electronic devices. With the increase of these parameters while operating the chip, changes occur in electrical resistance and many other factors which results in increase of heat dissipation, and this phenomenon is referred as Thermal loss. Electronic devices need to be kept cold and free from heat dissipation in order to function efficiently, have a high degree of reliability and have a long lifespan.
REDUCING THE THERMAL LOSS:
After the manufacturing of chips, they are tested in the range of military temperatures (−55°C to 125°C) which tends to observe the amount of heat dissipated. To prevent overheating of the chip for achieving efficient heat dissipation, various cooling techniques like Passive thermal dissipation, Active thermal dissipation, Temperature sensors and Heat sink compounds are used.
Passive and Active Thermal Dissipation:
Passive thermal dissipation systems do not require any external secondary power supply whereas Active thermal dissipation systems are specialized cooling solution that uses powered processes to enhance cooling capacity. Heat sinks and Natural convention are the techniques comes under Passive thermal dissipation systems. Fans and Liquid Cooling are the techniques comes under Active thermal dissipation systems.
Temperature Sensors:
A temperature sensor is a device that measures the degree of hotness present in the circuit. Thermistors acts as temperature sensors, generally thermistors are diodes where the temperature is measured across the terminals of the diode by varying the voltage. These sensors sense the temperature which prevents the device from overheating.
1.Negative Temperature Coefficient Thermistor: As the temperature increases the resistance of the device decreases.
2.Positive Temperature Coefficient Thermistor: As the temperature increases the resistance of the device increases.
Heat sink Compound:
Heat sink compound also known as thermal grease or thermal interface material (TIM), is a sticky paste used as an interface between CPU heat sinks and heat sources such as high-power semiconductor devices. Its primary purpose is to maximize heat transfer and dissipation by eliminating air gaps or spaces that act as thermal insulation.
